Low-Temperature and Rapid-Cure Liquid Polyimide for Roll-to-Roll Coating Applications

Presented by John Park, HD MicroSystems

In roll-to-roll (R2R) manufacturing, polyimide is commonly used in film form, with DuPont's Kapton® being a prime example due to its excellent mechanical, thermal, and electrical properties, making it suitable for various industries. HD MicroSystems is a leading supplier of polyimide precursors, primarily serving the semiconductor packaging sector. Polyimide's exceptional characteristics as a super engineering plastic are expected to offer numerous advantages in the R2R field. Polymers used in the converting industry require lower drying conditions than those used in wafer substrate-based semiconductor packaging processes. In this talk, we will discuss our recent development of next-generation, low-cost, rapid-cure liquid polyimide designed for low-temperature, rapid-drying R2R processes. We will also present our work on R2R coating trials with this new liquid polyimide and explore its potential applications.