Printed/Flexible Electronics

The Business Case for Driving Standards in Flexible Electronics Members Public

Presented by John Maltabes, Applied Materials Web Coating GmbH

Kevin Lifsey
Conference Proceedings

Static Protection Design for Printed Electronics Members Public

Presented by Kelly Robinson, Electrostatic Answers LLC Electrostatic Discharges (ESD) or sparks can damage electronic devices. An energetic spark can cause thermal damage (burn components). And, the current surge from the spark can damage conductive traces and cause momentary high voltages that damage insulating layers. Static control for traditional semiconductor

Kevin Lifsey
Conference Proceedings

Roll-to-Roll Nanofabrication Process for Flexible Cu Metal Mesh Transparent Conducting Electrodes Members Public

Presented by Ziam Ghaznavi, Emerson & Renwick

Kevin Lifsey
Conference Proceedings

Process Optimization in the Large-scale Manufacture of Flexible Hybrid Electronics Members Public

Presented by Enid Kivuti, Sheldahl The presentation will provide an overview of proven paths to improve time to market, cost of ownership and use experience in scaling up production of printed sensors for the Medical and Automotive markets. Beginning with material choice and available manufacturing schemes and concluding with proposed

Kevin Lifsey
Conference Proceedings

Anisotropic Conductive Films made by Electric Particle Alignment on R2R Members Public

Presented by Henrik Hemmen, CondAlign AS (Norway) Anisotropic conductive films made by electric particle alignment on R2R CondAlign AS develops anisotropic materials and production technologies based on our patented particle alignment process. In the CondAlign process, electric fields are applied to polymer matrices to manipulate and align dispersed particles. The

Kevin Lifsey
Conference Proceedings

Thermoset film offers soft, high temperature-resistant stretchability for printed electronics: Part 1 Members Public

A primary factor limiting the deployment of printed electronics is a dearth of application-specific substrates. Conventional thermoplastic polymer films like TPU and PET, typically employed for printed electronics, exhibit poor temperature resistance and relatively high hysteresis, creating significant challenges for printing and curing of functional materials, such as conductive pastes,

Alex Nevels
Converting Quarterly

Thermoforming as a design tool in printed-electronics applications Members Public

To date, the benefits of two-dimensional (2D) printed electronics have been widely realized when the printed flat components can be integrated into the target device without many design constraints. However, it often can be challenging to fit the printed 2D surfaces fully conformally onto complex surfaces of a 3D device,

Alex Nevels
Converting Quarterly

Special Market Report: Printed & Flexible Electronics Members Public

In this issue: * Tech Forecast: Are printed & flexible electronics finally on a roll? * "Gap Analysis" helps industry advance business, technology * Ellipsometry on flexible substrates * Thermoforming as a design tool in printed-electronics applications * Thermoset film offers soft, high-temperature-resistant stretchability: Part 1 Click the link below to download the

Alex Nevels
Converting Quarterly