Low-Monomer, Fast-Bond Adhesives

Presented by Pierangelo Brambilla, DOW

Due to the evolving nature and more stringing requirement of European and local food legislation and with regards also to FDA food approval, Dow started to develop a new solvent less technology combining ultra fast Primary Aromatic Amine decays with fast curing speed allowing customers to shorter their supply chain and keep the commitment of delivery a food safety and performing packaging to the market.