Formulating Substrates for Winding in Vacuum Metallization

Presented by Eldridge M. Mount III, EMMOUNT Technologies LLC

This talk will focus on the special formulation requirements of vacuum metallization substrates. In particular it will look at the special requirements for winding and transporting films in vacuum. A review of existing substrate slip and antiblock technologies and their relative impact on winding and web transport will be presented and then the winding requirements for metallization will be reviewed. Film surface formulations and substrate structure will be examined for its impact on roll formation in the presence and absence of air.