A primary factor limiting the deployment of printed electronics is a dearth of application-specific substrates. Conventional thermoplastic polymer films like TPU and PET, typically employed for printed electronics, exhibit poor temperature resistance and relatively high hysteresis, creating significant challenges for printing and curing of functional materials, such as conductive pastes, surface-mount assembly processes and end-use durability. Researchers at this firm developed a new class of thermoset: soft, high-temperature resistant, stretchable film designed specifically for printed electronics and soft circuit manufacturing. This article will discuss the substrate technology in detail, including testing results and highlight some use-case parts fabricated with these materials.
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